Microchip Technology MCP1630 Guia do Utilizador Página 3

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MCP1630 BOOST MODE LED DRIVER
DEMO BOARD USERS GUIDE
© 2007 Microchip Technology Inc. DS51665B-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History................................................................................... 4
Chapter 1. Product Overview ....................................................................................... 5
1.1 Introduction ..................................................................................................... 5
1.2 Features ......................................................................................................... 5
1.3 Device Summary ............................................................................................ 5
1.4 Technical Specifications ................................................................................. 6
Chapter 2. Installation and Operation ......................................................................... 7
2.1 Getting Started ............................................................................................... 7
2.2 What the MCP1630 Boost Mode LED Driver Demo Board Kit includes ......... 7
2.3 Setup Procedures ........................................................................................... 8
2.4 Circuit Description .......................................................................................... 9
2.5 Firmware Description ................................................................................... 10
Appendix A. Schematic and Layouts ........................................................................ 13
A.1 Introduction .................................................................................................. 13
A.2 Board - Schematic ....................................................................................... 14
A.3 Board - Top Layer ........................................................................................ 15
A.4 Board - Top Silk Layer ................................................................................. 16
A.5 Board - Bottom Layer ................................................................................... 17
Appendix B. Bill Of Materials (BOM) ......................................................................... 19
Appendix C. Firmware Flowchart .............................................................................. 21
Worldwide Sales and Service .................................................................................... 24
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